Vacuum wafer chuck for manufacturing semiconductor devices

ABSTRACT

Disclosed is a substrate displacing assembly so as to improve its durability during a semiconductor processing. In one embodiment, a semiconductor manufacturing system, includes, a substrate holder, wherein the substrate holder is configured with a plurality of pins; and a substrate displacing assembly for displacing a substrate on the substrate holder in a first direction perpendicular to the top surface of the substrate holder through the plurality of pins, wherein the substrate displacing assembly comprises a pair of load forks, a coupler and a driving shaft, wherein the pair of load forks comprises a fork region and a base region, wherein the coupler is mechanically coupled to the base region through at least one first joining screw extending in the first direction, wherein the coupler is further mechanically coupled to the driving shaft through a second joining screw extending in the first direction.

RELATED APPLICATIONS

This application is a division of U.S. patent application Ser. No.16/870,336, filed May 8, 2020, the entirety of which is incorporated byreference herein.

BACKGROUND

In the semiconductor integrated circuit (IC) industry, there is acontinuing demand for smaller device dimensions and higher circuitpacking densities. This demand has driven the semiconductor industry todevelop new materials and complex processes. For example, when a feature(e.g., a gate/drain/source feature of a transistor, a horizontalinterconnect line, or a vertical via, etc.) is to be formed on a wafer,the wafer typically goes through mechanisms which comprises multipleprocessing stations typically using different process tools to performvarious operations such as cleaning, photolithography, dielectricdeposition, dry/wet etching, and metal deposition, for example. However,the mechanisms for lifting and moving substrates in the processingstations often face frequent mechanical failure affecting themanufacturing yield. Thus, existing mechanisms are not entirelysatisfactory.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that various features are not necessarily drawn to scale. In fact,the dimensions and geometries of the various features may be arbitrarilyincreased or reduced for clarity of illustration.

FIG. 1A illustrates an exemplary block diagram of a semiconductorprocessing system, in accordance with some embodiments of presentdisclosure.

FIG. 1B illustrates an exemplary block diagram of a local computer whichmay be used for implementing the methods described herein, in accordancewith some embodiments of the invention.

FIG. 2A illustrates an exemplary semiconductor processing system, inaccordance with some embodiments of the present disclosure.

FIGS. 2B-2C illustrates exemplary perspective view and side viewdiagrams of a substrate displacing assembly, in accordance with someembodiments of the present disclosure.

FIGS. 3A-3B illustrate exemplary perspective, top-view and side viewdiagrams of a coupler, in accordance with some embodiments of thepresent disclosure.

FIG. 4 illustrates a flow chart of a method to displace a substrateduring a semiconductor manufacturing process, in accordance with someembodiments of present disclosure.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following disclosure describes various exemplary embodiments forimplementing different features of the subject matter. Specific examplesof components and arrangements are described below to simplify thepresent disclosure. These are, of course, merely examples and are notintended to be limiting. For example, it will be understood that when anelement is referred to as being “connected to” or “coupled to” anotherelement, it may be directly connected to or coupled to the otherelement, or one or more intervening elements may be present.

The presented disclosure provides various embodiments of a method andsystem for lifting and moving substrate in a processing station withimproved reliability. Accordingly, the above-mentioned issues may beadvantageously avoided.

This description of the exemplary embodiments is set to be understood inconnection with the figures of the accompanying drawing, which are to beconsidered part of the entire written description. In the description,relative terms such as “lower,” “upper,” “horizontal,” “vertical,”“above,” “below,” “up,” “down,” “top” and “bottom” as well asderivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,”etc.) should be construed to refer to the orientation as then describedor as shown in the drawing under discussion. These relative terms arefor convenience of description and do not require that the apparatus beconstructed or operated in a particular orientation.

FIG. 1A illustrates an exemplary block diagram of a semiconductorprocessing system 100, in accordance with some embodiments of presentdisclosure. It is noted that the semiconductor processing system(hereinafter “system”) 100 is merely an example, and is not intended tolimit the present disclosure. Accordingly, it is understood thatadditional functional blocks may be provided in or coupled to thesemiconductor processing system 100 of FIG. 1, and that some otherfunctional blocks may only be briefly described herein.

In the illustrated embodiment, the system 100 comprises a plurality ofprocessing stations for Integrated Circuit (IC) manufacturing processes,e.g., a first processing station 102-1, a second processing station102-2, and a third processing station 102-3. Examples of the ICmanufacturing processes conducted in the processing stations 102-1,102-2, and 102-3 include cleaning, photolithography, wet etching, dryetching, dielectric deposition, metal deposition, and may include anyother semiconductor processes known in the art. In some embodiments, thefirst processing station 102-1 is a photolithography station, the secondprocessing station 102-2 is a plasma processing station; and the thirdprocessing station 102-3 is a deposition station. At least one featurecan be created in each processing station 102-1/102-2/102-3 including aphotoresist pattern, a metal contact, an etch trench, an isolation, avia structure/hole, an interconnect line, and the like.

Each of the processing stations 102-1/102-2/102-3 comprises a substrateholder (not shown) for holding a substrate during the semiconductormanufacturing process. In some embodiments, the substrate holder maycomprises a plurality of pins. In some other embodiments, the substrateholder may further comprises at least one vacuum groove for securing thesubstrate on the substrate holder. In some embodiments, the plurality ofpins are configured on the substrate holder which can be lifted by asubstrate displacing assembly configured at the bottom side of thesubstrate holder. In some embodiments, the substrate displacing assemblyconfigured on the bottom side and below the substrate holder, whereinthe position of the substrate displacing assembly can be controlledthrough a coupled driving shaft, by selectively moving the plurality ofpins up and down so as to lift up or set down the substrate from/to thesubstrate holder. In some embodiments, the substrate displacing assemblycomprises inner materials, such as ceramic, graphite, etc.

In some embodiments, the substrate holder may further comprise at leastone temperature control/sensing unit 205. In some embodiments, atemperature control/sensing unit 205 comprises at least one heatingelement, at least one cooling element and at least one temperaturesensing element.

In some embodiments, a heating element can be a Peltier device and/orresistive heater such as polyimide heater, silicone rubber heater, micaheater, metal heater (e.g. W, Ni/Cr alloy, Mo or Ta), ceramic heater(e.g. WC), semiconductor heater, carbon heater, or any other suitabletype of heating element as desired. The heating element can beimplemented in various designs or configurations, such as being screenprinted, wire wound, etched foil heaters, or any other suitable designas desired.

In some embodiments, a cooling element is configured in the vacuum chuckto control the temperature of the substrate holder so as to control thetemperature of the warped substrate. In some embodiments, liquid orgaseous coolant passing through the cooling element can be chilled withan external chiller (not shown) for greater cooling effect, and can berecirculated for greater efficiency. The external chiller cooling andrecirculating a coolant fluid can be controlled by the controller 112.Faster cooling rate is possible if a chiller is used to cool the coolantfluid to a temperature below atmospheric, in accordance with someembodiments. In some embodiments, the cooling element may not benecessary. In some embodiments, the cooling element can be cryogenic.

In some embodiments, the sensing element is configured in the substrateholder for detecting local temperature of the vacuum chuck through atemperature sensing circuit. This is particularly useful in regulatingthe temperature of the substrate with a desired time response. In someembodiments, different types of sensing elements can be implemented,including contact and non-contact temperature sensors depending on thedesired performance, e.g., detection range, sensitivity, accuracy,response time, repeatability, size, power consumption, cost, etc. Insome embodiments, a contact type temperature sensor can be a thermostatconsisting two different metals (e.g., nickel, copper, tungsten,aluminum, etc.), a thermistor typically consisting ceramic materials(e.g., oxides of nickel, manganese, cobalt, etc.), a thin film resistivesensor typically consisting thin high-purity conducting metals (e.g.,platinum, copper, nickel, etc.), a thermocouple consisting two differentmetals (e.g., copper, iron, a variety of metal alloys, etc.) and twojunctions, semiconductor junctions sensors, infra-red radiation sensorand the like. In some embodiments, the heating elements can be alsofunction as temperature sensing elements.

The local computers 112-1, 112-2 and 112-3 are each coupled to a remotecomputer resource 110 through a connection 108. In some embodiments, theconnection 108 may include an Ethernet cable, an optical fiber, awireless communication media, and/or other networks known in the art. Insome embodiments, the remote computer resource 110 includes a computernetwork, one or more servers, applications, and/or data centers,generally known as the “cloud” or cloud computing. It should beunderstood that other connections and intermediate circuits can bedeployed between the local computers 112-1, 112-2 and 112-3 associatedwith the processing stations 102-1, 102-2 and 102-3, and the remotecomputer resource 110 to facilitate interconnection. In someembodiments, the local computer 116 configures processing conditions andprovides control signals to the corresponding processing station 102.

Although the system 100 in the illustrated embodiment of FIG. 1 includesonly three processing stations 102-1/102-2/102-3, three local computers112-1/112-2/112-3, and one remote computer resource 110, it isunderstood that the embodiment of FIG. 1 is merely provided forillustration purposes. The system 100 may include any desired number ofprocessing stations while remaining within the scope of the presentdisclosure.

FIG. 1B illustrates an exemplary block diagram of a local computer 112which may be used for implementing the methods described herein, inaccordance with some embodiments of the invention. It is noted that thelocal computer 112 is merely an example, and is not intended to limitthe invention. Accordingly, it is understood that additional functionalblocks may be provided in or coupled to the computer apparatus of FIG.1B, and that some other functional blocks may be omitted or only brieflydescribed herein. It should be also noted that the functionalitiesprovided in each of the components and modules of the local computer 112can be combined or separated into one or more modules.

In the illustrated embodiment, the local computer 112 comprises aprocessor 122, a memory 124, an input/output interface 126, acommunications interface 128, and a system bus 130, in accordance withsome embodiments. The processor 122 may comprise any processingcircuitry operative to control the operations of the processing station102. In various aspects, the processor 122 may be implemented as ageneral purpose processor, a chip multiprocessor (CMP), a dedicatedprocessor, an embedded processor, a digital signal processor (DSP), anetwork processor, an input/output (I/O) processor, a media accesscontrol (MAC) processor, a radio baseband processor, a co-processor, amicroprocessor such as a complex instruction set computer (CISC)microprocessor, a reduced instruction set computing (RISC)microprocessor, and/or a very long instruction word (VLIW)microprocessor, or other processing device. The processor 122 also maybe implemented by a controller, a microcontroller, an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), a programmable logic device (PLD), and so forth.

In various aspects, the processor 122 may be arranged to run anoperating system (OS) and various applications. Examples of an OScomprise, for example, operating systems generally known under the tradename of Apple OS, Microsoft Windows OS, Android OS, and any otherproprietary or open source OS. Examples of applications comprise, forexample, a telephone application, a camera (e.g., digital camera, videocamera) application, a browser application, a multimedia playerapplication, a gaming application, a messaging application (e.g., email,short message, multimedia), a viewer application, and so forth.

In some embodiments, at least one non-transitory computer-readablestorage medium is provided having computer-executable instructionsembodied thereon, wherein, when executed by at least one processor, thecomputer-executable instructions cause the at least one processor toperform embodiments of the methods described herein. Thiscomputer-readable storage medium can be embodied in the memory 124.

In some embodiments, the memory 124 may comprise any machine-readable orcomputer-readable media capable of storing data, including bothvolatile/non-volatile memory and removable/non-removable memory. Thememory 124 may comprise at least one non-volatile memory unit. Thenon-volatile memory unit is capable of storing one or more softwareprograms. The software programs may contain, for example, applications,user data, device data, and/or configuration data, or combinationstherefore, to name only a few. The software programs may containinstructions executable by the various components of the robotcontroller of the tray-handling system 704.

For example, memory may comprise read-only memory (ROM), random-accessmemory (RAM), dynamic RAM (DRAM), Double-Data-Rate DRAM (DDR-RAM),synchronous DRAM (SDRAM), static RAM (SRAM), programmable ROM (PROM),erasable programmable ROM (EPROM), electrically erasable programmableROM (EEPROM), flash memory (e.g., NOR or NAND flash memory), contentaddressable memory (CAM), polymer memory (e.g., ferroelectric polymermemory), phase-change memory (e.g., ovonic memory), ferroelectricmemory, silicon-oxide-nitride-oxide-silicon (SONOS) memory, disk memory(e.g., floppy disk, hard drive, optical disk, magnetic disk), or card(e.g., magnetic card, optical card), or any other type of media suitablefor storing information.

In one embodiment, the memory 124 may contain an instruction set, in theform of a file for executing a method of generating one or more timinglibraries as described herein. The instruction set may be stored in anyacceptable form of machine-readable instructions, including source codeor various appropriate programming languages. Some examples ofprogramming languages that may be used to store the instruction setcomprise, but are not limited to: Java, C, C++, C#, Python, Objective-C,Visual Basic, or .NET programming In some embodiments a compiler orinterpreter is comprised to convert the instruction set into machineexecutable code for execution by the processor.

In some embodiments, the I/O interface 126 may comprise any suitablemechanism or component to enable a user to provide input to theprocessing station 102 or to provide output to the user. For example,the I/O interface 126 may comprise any suitable input mechanism,including but not limited to, a button, keypad, keyboard, click wheel,touch screen, or motion sensor. In some embodiments, the I/O interface126 may comprise a capacitive sensing mechanism, or a multi-touchcapacitive sensing mechanism (e.g., a touchscreen).

In some embodiments, the I/O interface 126 may comprise a visualperipheral output device for providing a display visible to the user.For example, the visual peripheral output device may comprise a screensuch as, for example, a Liquid Crystal Display (LCD) screen,incorporated into the local computer 112. As another example, the visualperipheral output device may comprise a movable display or projectingsystem for providing a display of content on a surface remote the localcomputer 112. In some embodiments, the visual peripheral output devicecan comprise a coder/decoder, also known as a Codec, to convert digitalmedia data into analog signals. For example, the visual peripheraloutput device may comprise video Codecs, audio Codecs, or any othersuitable type of Codec.

The visual peripheral output device also may comprise display drivers,circuitry for driving display drivers, or both. The visual peripheraloutput device may be operative to display content under the direction ofthe processor. For example, the visual peripheral output device may beable to play media playback information, application screens forapplications implemented on the computer apparatus, informationregarding ongoing communications operations, information regardingincoming communications requests, or device operation screens, to nameonly a few.

In some embodiments, the communications interface 128 may comprise anysuitable hardware, software, or combination of hardware and softwarethat is capable of coupling the local computer 112 to one or morenetworks and/or additional devices. The communications interface 128 maybe arranged to operate with any suitable technique for controllinginformation signals using a desired set of communications protocols,services or operating procedures. The communications interface 128 maycomprise the appropriate physical connectors to connect with acorresponding communications medium, whether wired or wireless.

Systems and methods of communication comprise a network, in accordancewith some embodiments. In various aspects, the network may compriselocal area networks (LAN) as well as wide area networks (WAN) includingwithout limitation Internet, wired channels, wireless channels,communication devices including telephones, computers, wire, radio,optical or other electromagnetic channels, and combinations thereof,including other devices and/or components capable of/associated withcommunicating data. For example, the communication environments comprisein-body communications, various devices, and various modes ofcommunications such as wireless communications, wired communications,and combinations of the same.

Wireless communication modes comprise any mode of communication betweenpoints (e.g., nodes) that utilize, at least in part, wireless technologyincluding various protocols and combinations of protocols associatedwith wireless transmission, data, and devices. The points comprise, forexample, wireless devices such as wireless headsets, audio andmultimedia devices and equipment, such as audio players and multimediaplayers, telephones, including mobile telephones and cordlesstelephones, and computers and computer-related devices and components,such as printers, network-connected machinery such as a circuitgenerating system, and/or any other suitable device or third-partydevice.

Wired communication modes comprise any mode of communication betweenpoints that utilize wired technology including various protocols andcombinations of protocols associated with wired transmission, data, anddevices. The points comprise, for example, devices such as audio andmultimedia devices and equipment, such as audio players and multimediaplayers, telephones, including mobile telephones and cordlesstelephones, and computers and computer-related devices and components,such as printers, network-connected machinery, and/or any other suitabledevice or third-party device. In various implementations, the wiredcommunication modules may communicate in accordance with a number ofwired protocols. Examples of wired protocols may comprise UniversalSerial Bus (USB) communication, RS-232, RS-422, RS-423, RS-485 serialprotocols, FireWire, Ethernet, Fiber Channel, MIDI, ATA, Serial ATA, PCIExpress, T-1 (and variants), Industry Standard Architecture (ISA)parallel communication, Small Computer System Interface (SCSI)communication, or Peripheral Component Interconnect (PCI) communication,to name only a few examples.

Accordingly, in various aspects, the communications interface 128 maycomprise one or more interfaces such as, for example, a wirelesscommunications interface, a wired communications interface, a networkinterface, a transmit interface, a receive interface, a media interface,a system interface, a component interface, a switching interface, a chipinterface, a controller, and so forth. When implemented by a wirelessdevice or within wireless system, for example, the communicationsinterface may comprise a wireless interface comprising one or moreantennas, transmitters, receivers, transceivers, amplifiers, filters,control logic, and so forth.

In various embodiments, the communications interface 128 may providevoice and/or data communications functionality in accordance a number ofwireless protocols. Examples of wireless protocols may comprise variouswireless local area network (WLAN) protocols, including the Institute ofElectrical and Electronics Engineers (IEEE) 802.xx series of protocols,such as IEEE 802.11a/b/g/n, IEEE 802.16, IEEE 802.20, and so forth.Other examples of wireless protocols may comprise various wireless widearea network (WWAN) protocols, such as GSM cellular radiotelephonesystem protocols with GPRS, CDMA cellular radiotelephone communicationsystems with 1×RTT, EDGE systems, EV-DO systems, EV-DV systems, HSDPAsystems, and so forth. Further examples of wireless protocols maycomprise wireless personal area network (PAN) protocols, such as anInfrared protocol, a protocol from the Bluetooth Special Interest Group(SIG) series of protocols, including Bluetooth Specification versionsv1.0, v1.1, v1.2, v2.0, v2.0 with Enhanced Data Rate (EDR), as well asone or more Bluetooth Profiles, and so forth. Yet another example ofwireless protocols may comprise near-field communication techniques andprotocols, such as electromagnetic induction (EMI) techniques. Anexample of EMI techniques may comprise passive or active radio-frequencyidentification (RFID) protocols and devices. Other suitable protocolsmay comprise Ultra Wide Band (UWB), Digital Office (DO), Digital Home,Trusted Platform Module (TPM), ZigBee, and so forth.

The system bus 130 couples the processor 122, the memory 124, the I/Ointerface 126, and the communication interface 128 to one another, asnecessary. The system bus 130 can be any of several types of busstructure(s) including a memory bus or memory controller, a peripheralbus or external bus, and/or a local bus using any variety of availablebus architectures including, but not limited to, 9-bit bus, IndustrialStandard Architecture (ISA), Micro-Channel Architecture (MCA), ExtendedISA (EISA), Intelligent Drive Electronics (IDE), VESA Local Bus (VLB),Personal Computer Memory Card International Association (PCMCIA) Bus,Small Computer System Interface (SCSI) or other proprietary bus, or anycustom bus suitable for computing device applications.

FIG. 2A illustrates an exemplary semiconductor processing system 200, inaccordance with some embodiments of the present disclosure. In theillustrated embodiment, the semiconductor processing system 200comprises a chamber 202, a substrate holder 204, and a substratedisplacing assembly 210. In some embodiments, the substrate holder 204is for holding and securing a semiconductor wafer 206 during asemiconductor manufacturing process performed in the chamber 202.Examples of the semiconductor manufacturing process conducted in thechamber 202 includes at least one of the following: cleaning,photolithography, wet etching, dry etching, dielectric deposition, metaldeposition, and any other semiconductor processes known in the art. Insome embodiments, the chamber 202 is for depositing a semiconductorlayer on the semiconductor substrate 206 using a chemical vapordeposition (CVD) process.

In the illustrated embodiment, the substrate holder 204 comprises aplurality of pins 208 extending from the top surface to the back surfaceof the substrate holder 204. In some embodiments, each of the pluralityof pins 208 may be one of the following: a retractable spring loadedguide pin, a self-contained pin, a through pin and other type of pinsknown in the art. In some embodiments, each of the plurality of pins 208is made of stainless steel, alumina, copper, plastic, or ceramic,depending on the specific conditions of the semiconductor manufacturingprocess conducted in the chamber 202. In the illustrated embodiments,the plurality of pins 208 configured in the substrate holder 204 can beactivated through the back of the substrate holder 204 in order to liftup the substrate 206 from the substrate holder 204 or set down thesubstrate 206 to the substrate holder 204.

In the illustrated embodiment, the substrate displacing assembly 210 isconfigured below the substrate holder 204 for activating the pluralityof pins 208 in the y direction. The substrate displacing assembly 210,in the illustrated embodiment, comprises a pair of load forks 212, acoupler 214, a driving shaft 216, and a driving mechanism 218. In someembodiments, the pair of load forks 212 is coupled to the driving shaft216 through the coupler 214, wherein the driving shaft 216 is furthermechanically coupled to the driving mechanism 218. In some embodiments,the driving mechanism 218 is configured outside of the chamber 202. Insome embodiments, the driving mechanism 218 comprises a linear motor anda ball screw, which can transfer a rotation motion to a linear motion ofthe pair of load forks 212 in they direction.

FIGS. 2B-2C illustrates exemplary perspective and side view diagrams ofa substrate displacing assembly 210, in accordance with some embodimentsof the present disclosure. In the illustrated embodiment, the substratedisplacing assembly 210 comprises a pair of load forks 212, a coupler214 and a driving shaft 216. In some embodiments, the pair of load forks212 has an inner diameter 211A and an outer dimeter 211B. In someembodiments, the inner diameter 211A and the outer diameter 211B isconfigured so as to align with a substrate holder 204 and a plurality ofpins 208. In some embodiments, the pair of load forks 212 has a unibodyconstruction with a base region 222A and a fork region 222B. In someembodiments, the unibody of the pair of load forks 212 is made of inertmaterials, for example, ceramic, graphite and plastic to preventintroducing chemical contamination to the chamber 202 and to thesemiconductor manufacturing process.

In some embodiments, the base region 222A is a region configured to bemechanically assembled with the coupler 214. In some embodiments, theunibody construction improves rigidity and reduces failure. In someembodiments, the base region 222A of the pair of load forks 212 has afirst thickness 240 and the fork region 222B of the pair of load forks212 has a second thickness 242. In some embodiments, the first thickness240 is greater than the second thickness 242. In some embodiments, thefirst thickness is greater than 3 millimeters. In some embodiments, thefirst thickness 240 is 11.56 millimeters and the second thickness is3.56 millimeters.

In the illustrated embodiments, the base region 222A comprises twomounting holes 226A. In some embodiments, the base region 222A furthercomprises two cutout regions 224. In some embodiments, each of the twomounting holes 226A extends from the tops surface to the back surface ofthe base region 222A for receiving jointing screws 234. In someembodiments, the joining screws 234 mechanically couple the pair of loadforks 212 to the coupler 214. In some embodiments, the back surface ofthe base region 222A further comprises two dent holes 236 for alignmentpurposes. In some embodiments, each of the two dent holes 236 has a bowlshape which is configured for receiving alignment pins 228 on thecoupler 214.

In the illustrated embodiment, the coupler 214 comprises a flange region302 (FIG. 3A) and a tube region 310 (FIG. 3A). In some embodiments, theflange region 302 has a circular shape with a diameter 246 in the rangedof 40.0 to 45.0 millimeters, and preferably 42.0 millimeters, and athickness 244 in the range of 4.0 to 6.0 millimeters, and preferably 5.0millimeters. In some embodiments, the flange region 302 furthercomprises 3 mounting holes 226B and 230A, wherein the mounting holes226B align with the mounting holes 226A on the pair of load forks 212for receiving jointing screws 234 and the mounting holes 230A forreceiving a jointing screw 232. In some embodiments, the mounting hole230A extends from the top surface to the back surface of the flangeregion 302 so as to receive the joining screw 232, which is used tomechanically couple the coupler 214 with the driving shaft 216. In someembodiments, the joining screw 232 after the coupler 214 is fullycoupled with the driving shaft 216, flushes with the top surface of theflange region 302. In some other embodiments, the joining screw 232after the coupler 214 is fully coupled with the driving shaft 216, islower than the top surface of the flange region 302.

In some embodiments, the flange region 302 further comprises 2 alignmentpins 228 which, when in alignment with the pair of load forks 212, lockin position with the dent holes 236 on the back surface of the pair ofload forks 212. In some embodiments, the tube region 310 under theflange region 302 has an inner diameter 252 in the range of 13.0 to 14.0millimeters, and preferably 13.8 millimeters, an outer diameter 254 inthe range of 20.0 to 22.0 millimeters, and preferably 21.0 millimeters,and a length 256 in the range of 25.0 to 26.0 millimeters, andpreferably 25.4 millimeters. In some embodiments, the tube region 310 iscoupled to the flange region 302 on a first end and the tube region isconfigured with a cutout region 238A on a second end for receiving a key238B configured on the sidewall of the driving shaft 216. In someembodiments, the coupler 214 is made of metal, for example aluminum.

In the illustrated embodiment, the driving shaft 216 has a diameter 250in a range of 12.0 to 13.0 millimeters, and preferably 12.68millimeters. In some embodiments, the driving shaft 216 comprises amounting hole 230B which aligns with the mounting hole 230A on theflange region of the coupler 214 for receiving the joining screw 232 tomechanically couple the coupler 214 and the driving shaft 216. In someembodiments, a clearance distance 248 between the inner wall of the tube310 of the coupler 214 and the side wall of the driving shaft 216 isgreater than 0.1 millimeters. In some embodiments, the clearancedistance 248 is 0.65 millimeters. In some embodiments, the driving shaft216 is made of metal, for example, aluminum.

FIGS. 3A-3B illustrate exemplary perspective top-view and side viewdiagrams of a coupler 300, in accordance with some embodiments of thepresent disclosure. In the illustrated embodiment, the coupler 300comprises a flange 302 and a tube 310. In some embodiments, the flange302 has a circular shape. In some embodiments, the flange 302 furthercomprises 3 mounting holes 304-1, 304-2 and 308. In some embodiments,the mounting hole 308 is configured at the center of the flange 302 andextends from a first surface 312 to a second surface 314 of the flange302. In some embodiments, the mounting hole 308 is configured to receivea jointing screw so as to mechanically couple the coupler 300 to adriving shaft. In some embodiments, the mounting holes 304-1 and 304-2are configured to align with mounting holes on a pair of load forks forreceiving jointing screws so as to mechanically couple the coupler 300with the pair of load forks. In some embodiments, the mounting holes304-1/304-2 extends from the top surface to the back surface of theflange region so as to receive the joining screw 232, which is used tomechanically couple the coupler 214 with the driving shaft 216. In someother embodiments, the mounting holes 304-1/304-2 are configured on thefirst surface 312 without extending to the second surface 314. In theillustrated embodiment, the flange 302 further comprises two alignmentpins 306 on the first surface 312, which are configured to align withdent holes on the pair of load forks.

In some embodiments, the tube 310 of the coupler 300 is coupled with theflange 302 on a first end and is configured with a cutout region 316 ona second end. In some embodiments, the cutout region 316 is configuredto receive a key pin on the driving shaft. In some embodiments, thecoupler 300 has a unibody construction. In some embodiments, the coupler300 is made of metal, for example, aluminum.

FIG. 4 illustrates a flow chart of a method 400 to displace a substrateduring a semiconductor manufacturing process, in accordance with someembodiments of present disclosure. In some embodiments, the operationsof method 400 are performed by the respective components illustrated inFIGS. 1-3. For purposes of discussion, the following embodiment of themethod 400 will be described in conjunction with FIGS. 1-3. Theillustrated embodiment of the method 400 is merely an example forholding a warped substrate on a vacuum chuck during a semiconductorprocessing. Therefore, it should be understood that any of a variety ofoperations may be omitted, re-sequenced, and/or added while remainingwithin the scope of the present disclosure.

The method 400 starts with operation 402 in which a substrate displacingassembly is assembled in a semiconductor manufacturing process chamberaccording to some embodiments. In some embodiments, the semiconductormanufacturing process chamber is in a semiconductor processing station202 for performing an IC manufacturing process, as described above withrespect to FIG. 1. Examples of the IC manufacturing processes conductedin the processing station include cleaning, photolithography, wetetching, dry etching, dielectric deposition, metal deposition, and anysemiconductor processes known in the art. In some embodiments, thesubstrate displacing assembly can include the features of substratedisplacing assembly 210 described above with reference to FIGS. 2A-3B.

The method 400 continues with operation 404 in which a substrate isdisplaced by the substrate displacing assembly 210 according to someembodiments. In some embodiments, the substrate 206 after being loadedin to the semiconductor manufacturing process chamber 202 is transferredto the substrate holder 204. In some embodiments, the substrate 206 issupported by a plurality of pins 208 configured on the substrate holder204. In some embodiments, the substrate 206 is then set down on to thetop surface of the substrate holder 204 by lowering the plurality ofpins 208 using the pair of load forks 212. In some embodiments, the pairof load forks 212 is controlled by the driving mechanism 218 through thedriving shaft 216 coupled by the coupler 214.

The method 400 continues with operation 406 in which a semiconductormanufacturing process is performed on the substrate 206 according tosome embodiments. Examples of the semiconductor manufacturing processconducted in the chamber 202 includes at least one of the following:cleaning, photolithography, wet etching, dry etching, dielectricdeposition, metal deposition, and any other semiconductor processesknown in the art. In some embodiments, the chamber 202 is for depositinga semiconductor layer on the semiconductor substrate 206 using achemical vapor deposition (CVD) process.

The method 400 continues with operation 406 in which the substrate isfurther displaced by the substrate displacing assembly 210 according tosome embodiments. In some embodiments, after the semiconductormanufacturing process is completed on the substrate 206, the substrate206 is then lifted from the substrate holder 204 by the plurality ofpins 208 which is pushed up in the y direction using the pair of loadforks 212 in the substrate displacing assembly 210. In some embodiments,the substrate 206 is removed from the semiconductor manufacturingprocess chamber for further processing or measurement.

In one embodiment, a semiconductor manufacturing system, includes, asubstrate holder, wherein the substrate holder is configured with aplurality of pins; and a substrate displacing assembly for displacing asubstrate on the substrate holder in a first direction perpendicular tothe top surface of the substrate holder through the plurality of pins,wherein the substrate displacing assembly comprises a pair of loadforks, a coupler and a driving shaft, wherein the pair of load forkscomprises a fork region and a base region, wherein the coupler ismechanically coupled to the base region through at least one firstjoining screw extending in the first direction, wherein the coupler isfurther mechanically coupled to the driving shaft through a secondjoining screw extending in the first direction.

In another embodiment, substrate displacing assembly for displacing asubstrate on a substrate holder, includes, a pair of load forks, whereinthe pair of load forks comprises a fork region and a base region; acoupler, wherein the coupler comprises a flange region and a tuberegion, wherein the coupler is mechanically coupled to the base regionthrough at least one first joining screw extending in a first direction;and a driving shaft, wherein the driving shaft is mechanically coupledto the coupler through a second joining screw extending in the firstdirection.

Yet, in another embodiment, method for handling a semiconductorsubstrate, includes: assembling a substrate displacing assembly;displacing a substrate using the substrate displacing assembly in afirst direction; and performing a semiconductor manufacturing process onthe substrate, wherein the substrate displacing assembly comprises, apair of load forks, a coupler, and a driving shaft, wherein the pair ofload forks comprises a fork region and a base region, wherein thecoupler comprises a flange region and a tube region, wherein the coupleris mechanically coupled to the base region through at least one firstjoining screw extending in the first direction; and wherein the drivingshaft is mechanically coupled to the coupler through a second joiningscrew extending in the first direction.

The foregoing outlines features of several embodiments so that thoseordinary skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those skilled in the art should also realize thatsuch equivalent constructions do not depart from the spirit and scope ofthe present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

In this document, the term “module” as used herein, refers to software,firmware, hardware, and any combination of these elements for performingthe associated functions described herein. Additionally, for purpose ofdiscussion, the various modules are described as discrete modules;however, as would be apparent to one of ordinary skill in the art, twoor more modules may be combined to form a single module that performsthe associated functions according embodiments of the invention.

A person of ordinary skill in the art would further appreciate that anyof the various illustrative logical blocks, modules, processors, means,circuits, methods and functions described in connection with the aspectsdisclosed herein can be implemented by electronic hardware (e.g., adigital implementation, an analog implementation, or a combination ofthe two), firmware, various forms of program or design codeincorporating instructions (which can be referred to herein, forconvenience, as “software” or a “software module), or any combination ofthese techniques. To clearly illustrate this interchangeability ofhardware, firmware and software, various illustrative components,blocks, modules, circuits, and steps have been described above generallyin terms of their functionality. Whether such functionality isimplemented as hardware, firmware or software, or a combination of thesetechniques, depends upon the particular application and designconstraints imposed on the overall system. Skilled artisans canimplement the described functionality in various ways for eachparticular application, but such implementation decisions do not cause adeparture from the scope of the present disclosure.

Furthermore, a person of ordinary skill in the art would understand thatvarious illustrative logical blocks, modules, devices, components andcircuits described herein can be implemented within or performed by anintegrated circuit (IC) that can include a general purpose processor, adigital signal processor (DSP), an application specific integratedcircuit (ASIC), a field programmable gate array (FPGA) or otherprogrammable logic device, or any combination thereof. The logicalblocks, modules, and circuits can further include antennas and/ortransceivers to communicate with various components within the networkor within the device. A general purpose processor can be amicroprocessor, but in the alternative, the processor can be anyconventional processor, controller, or state machine. A processor canalso be implemented as a combination of computing devices, e.g., acombination of a DSP and a microprocessor, a plurality ofmicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other suitable configuration to perform the functionsdescribed herein.

Conditional language such as, among others, “can,” “could,” “might” or“may,” unless specifically stated otherwise, are otherwise understoodwithin the context as used in general to convey that certain embodimentsinclude, while other embodiments do not include, certain features,elements and/or steps. Thus, such conditional language is not generallyintended to imply that features, elements and/or steps are in any wayrequired for one or more embodiments or that one or more embodimentsnecessarily include logic for deciding, with or without user input orprompting, whether these features, elements and/or steps are included orare to be performed in any particular embodiment.

Additionally, persons of skill in the art would be enabled to configurefunctional entities to perform the operations described herein afterreading the present disclosure. The term “configured” as used hereinwith respect to a specified operation or function refers to a system,device, component, circuit, structure, machine, etc. that is physicallyor virtually constructed, programmed and/or arranged to perform thespecified operation or function.

Disjunctive language such as the phrase “at least one of X, Y, or Z,”unless specifically stated otherwise, is otherwise understood with thecontext as used in general to present that an item, term, etc., may beeither X, Y, or Z, or any combination thereof (e.g., X, Y, and/or Z).Thus, such disjunctive language is not generally intended to, and shouldnot, imply that certain embodiments require at least one of X, at leastone of Y, or at least one of Z to each be present.

It should be emphasized that many variations and modifications may bemade to the above-described embodiments, the elements of which are to beunderstood as being among other acceptable examples. All suchmodifications and variations are intended to be included herein withinthe scope of this disclosure and protected by the following claims.

What is claimed is:
 1. A semiconductor manufacturing system, comprising:a substrate holder, wherein the substrate holder is configured with aplurality of pins; and a substrate displacing assembly for displacing asubstrate on the substrate holder in a first direction perpendicular tothe top surface of the substrate holder through the plurality of pins,wherein the substrate displacing assembly comprises a pair of loadforks, a coupler and a driving shaft, wherein the pair of load forkscomprises a fork region and a base region, wherein the coupler ismechanically coupled to the base region through at least one firstjoining screw extending in the first direction, wherein the coupler isfurther mechanically coupled to the driving shaft through a secondjoining screw extending in the first direction.
 2. The semiconductormanufacturing system of claim 1, wherein each of the plurality of pinsextends outwardly from the top surface to the back surface of thesubstrate holder.
 3. The semiconductor manufacturing system of claim 1,wherein a first thickness of the base region is greater than a secondthickness of the fork region.
 4. The semiconductor manufacturing systemof claim 1, wherein the base region is configured with at least onefirst mounting hole, wherein each of the at least one first mountinghole extends from the top surface to the back surface of the baseregion, wherein the coupler comprises a flange region, wherein theflange region is configured with at least one second mounting hole,wherein each of the at least one second mounting hole align with each ofthe at least one first mounting hole for receiving the at least onefirst joining screw.
 5. The semiconductor manufacturing system of claim4, wherein the coupler further comprises a tube region, wherein the tuberegion is coupled to the flange region on a first end, wherein the tuberegion further comprises a cutout region on a second end, and whereinthe tube region is configured to receive the driving shaft.
 6. Thesemiconductor manufacturing system of claim 5, wherein the cutout regionon the second end of the tube region of the coupler is to align with akey on the driving shaft.
 7. The semiconductor manufacturing system ofclaim 1, wherein a clearance distance in a second direction,perpendicular to the first direction, between the inner wall of the tuberegion of the coupler to the side wall of the driving shaft is greaterthan 0.1 millimeters.
 8. A semiconductor manufacturing system,comprising: a substrate holder; a substrate displacing assembly fordisplacing a substrate on the substrate holder in a first directionperpendicular to the top surface of the substrate holder, the substratedisplacing assembly comprising: a pair of load forks, wherein the pairof load forks comprises a fork region and a base region; a coupler,wherein the coupler comprises a flange region and a tube region, whereinthe coupler is mechanically coupled to the base region; and a drivingshaft, wherein the driving shaft is mechanically coupled to the coupler,wherein a clearance distance in a second direction, perpendicular to thefirst direction, between the inner wall of the tube region of thecoupler to the side wall of the driving shaft is greater than 0.1millimeters.
 9. The semiconductor manufacturing system of claim 8,wherein the fork region of the pair of load forks is configured to alignwith a plurality of pins extends outwardly from the top surface to theback surface of the substrate holder so as to push each of the pluralityof pins in the first direction.
 10. The semiconductor manufacturingsystem of claim 8, wherein a first thickness of the base region isgreater than a second thickness of the fork region.
 11. Thesemiconductor manufacturing system of claim 8, wherein the base regionis configured with at least one first mounting hole, wherein the flangeregion is configured with at least one second mounting hole, whereineach of the at least one first mounting hole extends from the topsurface to the back surface of the base region, and wherein each of theat least one second mounting hole align with each of the at least onefirst mounting hole for receiving the at least one first joining screw.12. The semiconductor manufacturing system of claim 8, wherein the tuberegion is coupled to the flange region on a first end, wherein the tuberegion further comprises a cutout region on a second end, and whereinthe tube region is configured to receive the driving shaft from thesecond end.
 13. The semiconductor manufacturing system of claim 12,wherein the cutout region on the second end of the tube region of thecoupler is to align with a key on the driving shaft.
 15. A method forhandling a semiconductor substrate, comprising: providing a substrateholder; providing a substrate displacing assembly for displacing asemiconductor substrate on the substrate holder in a first directionperpendicular to the top surface of the substrate holder displacing thesemiconductor substrate using the substrate displacing assembly in afirst direction; and performing a semiconductor manufacturing process onthe semiconductor substrate, wherein the substrate displacing assemblycomprises, a pair of load forks, a coupler, and a driving shaft, whereinthe pair of load forks comprises a fork region and a base region,wherein the coupler comprises a flange region and a tube region, whereinthe coupler is mechanically coupled to the base region, and the drivingshaft is mechanically coupled to the coupler, and wherein a clearancedistance in a second direction, perpendicular to the first direction,between the inner wall of the tube region of the coupler to the sidewall of the driving shaft is greater than 0.1 millimeters.
 16. Themethod of claim 15, wherein the fork region of the pair of load forks isconfigured to align with a plurality of pins extends outwardly from thetop surface to the back surface of the substrate holder so as to pusheach of the plurality of pins in the first direction.
 17. The method ofclaim 15, wherein a first thickness of the base region is greater than asecond thickness of the fork region.
 18. The method of claim 15, whereinthe base region is configured with at least one first mounting hole,wherein the flange region is configured with at least one secondmounting hole, wherein each of the at least one first mounting holeextends from the top surface to the back surface of the base region, andwherein each of the at least one second mounting hole align with each ofthe at least one first mounting hole for receiving the at least onefirst joining screw.
 19. The method of claim 15, wherein the tube regionis coupled to the flange region on a first end, wherein the tube regionfurther comprises a cutout region on a second end, wherein the tuberegion is configured to receive the driving shaft from the second end,and wherein the cutout region on the second end of the tube region ofthe coupler is to align with a key on the driving shaft.
 20. The methodof claim 15, wherein the coupler is mechanically coupled to the baseregion through at least one first joining screw extending in the firstdirection; and wherein the driving shaft is mechanically coupled to thecoupler through a second joining screw extending in the first direction.